Editorial Board

Editorial Board

Editor-in-Chief

Emanuël Habets, University of Erlangen-Nuremberg, Germany

Associate Editors

Jont B Allen, University of Illinois, United States of America

Xavier Anguera, Telefonica R&D, Spain

Roland Badeau, Telecom ParisTech, France

Gérard Bailly, GIPSA-Lab, France

Tom Bäckström, Friedrich Alexander University Erlangen-Nürnberg, Germany

Wai-Yip Geoffrey Chan, Queen University, Canada

Dan Chazan, IBM, Israel

Mark Clements, Georgia Institute of Technology, United States of America

Christophe D'Alessandro, CNRS, France

Roger Dannenberg, Carnegie Mellon University, United States of America

Nicholas Evans, EURECOM, France

Tim Fingscheidt, Technische Universität Braunschweig, Germany

Horacio Franco, SRI International Research Institute, United States of America

Qian-Jie Fu, House Ear Institute, United States of America

W S Gan, Nanyang Technological University, Singapore

Panayiotis G. Georgiou, USC Viterbi School of Engineering, United States of America

Philippe Gournay, University of Sherbrooke, Canada

Phil Green, University of Sheffield, United Kingdom

Rodrigo Capobianco Guido, São Paulo State University, Brazil

Richard Heusdens, Delft University of Technology, The Netherlands

Reinhold Häb-Umbach, University of Paderborn, Germany

Kate Knill, Cambridge University, United Kingdom

Yves Laprie, LORIA, France

Dominic W Massaro, University of California, United States of America

Ben Milner, University of East Anglia, United Kingdom

Climent Nadeu, Technical University of Catalonia, Spain

Elmar Nöth, Universität Erlangen-Nürnberg, Germany

Hiroshi G Okuno, Kyoto University, Japan

Nitendra Rajput, IBM Research, India

Gerhard Rigoll, Technical University of Munich, Germany

Hiroshi Saruwatari, Nara Institute of Science and Technology, Japan

T V Sreenivas, Indian Institute of Science, India

Yannis Stylianou, Foundation for Research and Technology - Hellas (FORTH), Greece

Tomoki Toda, Nara Institute of Science and Technology, Japan

Toon van Waterschoot, Katholieke Universiteit Leuven, Belgium

S Voran, Institute for Telecommunication Sciences, United States of America

DeLiang Wang, Ohio State University, United States of America